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Saki Set to Highlight Cutting-Edge Inspection Technology at SMTConnect 2024

05/15/2024 | Saki Corporation
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at SMTConnect 2024 in Nuremberg, Germany from June 11-13. As a key highlight of the Selecs booth #235 in Hall 4, Saki will be showcasing its unique range of automated inspection solutions including the award-winning X-ray Automated Inspection System (AXI) and innovative ‘One Programming’ and AI Solutions Features.

SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea

05/14/2024 | BUSINESS WIRE
SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.

MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites

05/14/2024 | Globe Newswire
This collaboration enables the two companies to bring to life the next phase of MerlinTPS’ next-gen platform, which is capable of providing positioning, navigation, timing (PNT) and geospatial radio frequency data.

KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024

05/14/2024 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.

LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

05/13/2024 | LPKF
The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.
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